Introduction Pseudo soldering is a defect that can occur during PCB assembly, resulting in poor solder joint reliability. It happens when the solder paste or component termination oxidizes during reflow, preventing proper wetting and adhesion. This leads to weakened interconnections prone to failure under thermal cycling or vibration. This article explores the root causes of […]
What is the difference between PCB and PCBA? - RAYPCB
Common PCB Assembly process defects and cause analysis
What Causes Solder Ball Formation During SMD Reflow?
RAYPCB
The Causes And Solutions Of PCB Pseudo Soldering - RAYPCB
Page 211 – RAYPCB
Deep learning based solder joint defect detection on industrial
Page 212 – RAYPCB
PCB Soldering-- 9 Common PCB Soldering Defects and Solutions
Common PCB Assembly Defects You Should Know
Page 210 – RAYPCB
What is the difference between PCB and PCBA? - RAYPCB